Ideal Etching Process Characteristics

The ideal etching process should have the following key characteristics to meet the high-precision requirements of semiconductor manufacturing and other micro nano processing fields:

① Anisotropic etching, which means only vertical etching without lateral drilling. Only in this way can we ensure the precise replication of geometric shapes identical to those on the resist on the etched film;
② Good etching selectivity means that the etching rate of the resist used as a mask and the underlying thin film or material is much lower than that of the etched thin film, to ensure the effectiveness of the resist masking during the etching process and prevent damage to other materials underneath the thin film due to over etching;
③ Large processing batches, easy control, low cost, minimal environmental pollution, suitable for industrial production.